2020
- M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020.
- M. Y. Tsai and Y. W. Wang, “A Theoretical Solution for Thermal Warpage of Flip-Chip Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 1 pp. 72-78, 2020
- Jiunn-Jong Wu, "Adhesive contact between a rigid sphere and a thin elastic layer bonded on a rigid foundation", Journal of Adhesion Science and Technology, 34(21), 2292-2315, 2020
- J.-W. Liaw, G. Liu, Y.-C. Ku, M.-K. Kuo, “Plasmon-enhanced photothermal and optomechanical deformations of a gold nanoparticle”, Nanomaterials 10, 1881, 2020.
- H. C. Chang, C. C. Chen, J. W. Liaw, W. D. Chiou, Y. H. Weng, Y. J. Chang, C. S. Lu, “The effects of dual-task in patients with Parkinson’s disease performing cognitive-motor paradigms”, J. Clinical Neuroscience 72, 72-78, 2020.